Silicon Ingot Cropping Machine SGC 30

Name: Silicon Ingot Cropping Machine SGC 30 - Vimfun Diamond Wire Saw
SKU: SGC 30
Price: 1.00 USD
Availability: InStock

SKU: SGC 30

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This Silicon Ingot Cropping Machine is a single-wire cutting machine designed for silicon rod segmentation. It uses a closed-loop diamond wire as the cutting tool, capable of both segmenting and slicing silicon rods. The machine can process 12-inch monocrystalline silicon rods, with an optional larger model available for handling 18-inch silicon rods. It offers precision and efficiency, making it an ideal choice for silicon rod processing.

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Shipping

We will put the machine into a wood crate and send the machine to your given address.It can be send by sea,by air or by train. The delivery cost will be given after have your detailed address.

Product Warranty

We offer a one-year free warranty on the equipment, covering the replacement of non-consumable parts. Additionally, we provide lifetime after-sales support for our equipment. Any issues can be diagnosed and repaired at any time by contacting us.

Machine Training

The equipment comes with a detailed user manual, and on-site training at our factory is available. If needed, our engineers can also visit your company for training.

Overall Information

We are a manufacturer of diamond wire cutting equipment. In addition to the listed equipment models, we can also customize machines according to customer requirements. By providing the product dimensions to be cut and the cutting specifications, we can quickly tailor the equipment to meet personalized needs.

The cutting tool used by our equipment is a diamond wire, which is available in both closed-loop and non-closed-loop types. The equipment structure includes vertical, horizontal, and gantry types. The cutting methods include dry cutting and wet cutting. The equipment functions are categorized into semi-automatic cutting, fully automatic slicing, CNC cutting of external profiles, CNC cutting of internal hole profiles, cutting of taper angles, and multi-wire cutting.

Each model of the listed equipment is available in various sizes, including large, medium, and small, to meet the cutting requirements of different material dimensions.

The wet cutting equipment can also be used for dry cutting. However, if you need to perform water-assisted cutting on a dry cutting machine, please contact us for waterproofing modifications.

The power supply of the equipment can be customized according to customer requirement.

Please contact us before placing an order to ensure that the selected equipment meets your needs.

Product Parameter

Function	CNC Slicing , cropping , Top&Tail Cut
Cut Method	Wet Cut
Size	≤ dia 300mm

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Description

Product Overview

The Silicon Ingot Cropping Machine SGC 30 is a specialized cutting machine designed for processing silicon ingots, commonly used in the semiconductor industry. This machine utilizes an endless diamond wire for efficient and precise cutting. With its fast cutting speed and low edge-chipping rate, the SGC 30 is ideal for cropping the heads and tails of silicon ingots, as well as for sectioning and slicing ingots into wafers. Featuring a gantry-style design with the cutting wire running parallel to the ground, this machine can process silicon ingots up to 12 inches in diameter, with an option available for 18-inch ingots.

Product Details

Key Features

Single-Wire Cutting System
- The SGC 30 uses a single endless diamond wire for cutting, delivering high precision and excellent surface quality with minimal kerf loss.
Gantry-Style Structure
- The cutting wire operates parallel to the ground, performing top-to-bottom cuts that provide stable and consistent results.
Automatic Ingot Cropping
- The machine can automatically remove the heads and tails of silicon ingots, improving productivity and reducing manual handling.
Sectioning and Slicing Capabilities
- In addition to cropping, the SGC 30 can divide ingots into smaller sections or slice them into wafers, offering flexible processing options for various semiconductor applications.
High Cutting Speed with Low Edge-Chipping
- Fast cutting speeds combined with a low edge-chipping rate ensure clean, precise cuts and higher yield.
12-Inch and 18-Inch Models
- The standard model can handle silicon ingots up to 12 inches, with an optional version capable of processing 18-inch ingots to meet larger production requirements.

Advantages

Fast and Precise Cutting: Delivers high cutting speeds with excellent precision, minimizing material waste and maximizing yield.
Low Edge-Chipping Rate: The advanced cutting technology ensures clean edges with minimal chipping, reducing post-processing needs.
Automatic Cropping: Reduces labor requirements by automating the removal of ingot heads and tails, streamlining production.
Flexible Processing Options: Capable of cropping, sectioning, and slicing, making it versatile for various semiconductor manufacturing needs.
Customizable for Larger Ingot Sizes: Models available for both 12-inch and 18-inch silicon ingots, providing scalability for different production scales.

Applications

The SGC 30 is specifically designed for the processing of silicon ingots in the semiconductor industry, including:

Ingot Cropping: Perfect for cropping the heads and tails of silicon ingots to prepare them for further processing.

With its advanced cutting capabilities, speed, and versatility, the Silicon Ingot Cropping Machine SGC 30 is the perfect solution for efficient and precise silicon ingot processing in the semiconductor industry.

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Key Features of Endless Diamond Wire Cutting Equipment:

Endless Wire Design:
- Utilizes a closed-loop diamond wire, typically less than 10 meters in length, which is significantly shorter compared to traditional diamond wire cutting machines (wire lengths exceeding 1000 meters).
- The endless design eliminates the need for frequent wire changes, improving operational efficiency.
High-Speed Wire Operation:
- The diamond wire operates at speeds of up to 80 meters/second, enabling fast cutting.
- High-speed operation ensures superior surface smoothness, eliminating or significantly reducing wire marks.
Wide Range of Applications:
- Suitable for cutting hard and brittle materials such as silicon, graphite, sapphire, quartz, alumina ceramics, silicon carbide, silicon nitride, and boron nitride.
- Especially effective for non-conductive materials (e.g., graphite) that cannot be processed using traditional EDM cutting techniques.
Exceptional Cutting Quality:
- Produces smooth cutting surfaces, often eliminating the need for additional polishing.
- Reduces material waste, which is particularly beneficial when working with expensive materials.
Eco-Friendly Operation:
- Can use water cooling or eco-friendly cooling liquids to minimize heat buildup and reduce dust emissions during cutting.

Application Fields:

Semiconductors: Cutting silicon wafers, sapphire substrates, quartz substrates, etc.
Optics: Processing optical glass, lens materials, and other precision optical components.
Renewable Energy: Cutting solar crystalline silicon and battery materials.
Aerospace: Precision machining of high-hardness ceramics and composite materials.
Other Industries: Precision machining of electronic ceramics, graphite molds, and more.

Comparison to Traditional Diamond Wire Cutting Machines:

Endless diamond wire machines feature shorter, more stable wires with higher operating speeds, making them ideal for precision applications.
No need to alternate the wire's running direction, simplifying the mechanical structure and reducing maintenance costs.

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