The Spiral Coated Diamond Wire Loop represents the third-generation advancement in diamond wire technology. Its innovative spiral coating design not only increases chip capacity but also effectively guides debris out of the cutting area, ensuring smoother and faster cutting performance.
This cutting wire is particularly well-suited for materials with medium hardness that generate a high amount of debris during processing. The enhanced chip clearance and debris management capabilities allow for significantly higher cutting speeds and extended wire lifespan, making it a reliable and cost-effective solution.
- Enhanced Chip Capacity: Spiral coating increases space for debris, improving cutting efficiency.
- Debris Guidance: Spiral design actively guides debris out, ensuring smoother operations.
- Longer Lifespan: Extended durability and faster cutting speeds for materials with medium hardness and high debris outpu
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