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Cutting Wire Saw Machine SGSM 40

Name: Cutting Wire Saw Machine SGSM 40 - Vimfun Diamond Wire Saw
SKU: SGR 40
Price: 1.00 USD
Availability: InStock

SKU: SGR 40

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This gantry-style cutting machine, also known as a Diamond Cutting Wire Saw Machine, uses an up-and-down motion of the diamond wire for cutting. Additionally, the wire can oscillate to enhance cutting efficiency, which is particularly beneficial for cutting ultra-hard materials. The oscillation angle of the wire can be freely set according to specific requirements. The machine is equipped with an automatic water circulation system, offering convenient operation and high cutting efficiency.

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Shipping

We will put the machine into a wood crate and send the machine to your given address.It can be send by sea,by air or by train. The delivery cost will be given after have your detailed address.

Product Warranty

We offer a one-year free warranty on the equipment, covering the replacement of non-consumable parts. Additionally, we provide lifetime after-sales support for our equipment. Any issues can be diagnosed and repaired at any time by contacting us.

Machine Training

The equipment comes with a detailed user manual, and on-site training at our factory is available. If needed, our engineers can also visit your company for training.

Overall Information

We are a manufacturer of diamond wire cutting equipment. In addition to the listed equipment models, we can also customize machines according to customer requirements. By providing the product dimensions to be cut and the cutting specifications, we can quickly tailor the equipment to meet personalized needs.

The cutting tool used by our equipment is a diamond wire, which is available in both closed-loop and non-closed-loop types. The equipment structure includes vertical, horizontal, and gantry types. The cutting methods include dry cutting and wet cutting. The equipment functions are categorized into semi-automatic cutting, fully automatic slicing, CNC cutting of external profiles, CNC cutting of internal hole profiles, cutting of taper angles, and multi-wire cutting.

Each model of the listed equipment is available in various sizes, including large, medium, and small, to meet the cutting requirements of different material dimensions.

The wet cutting equipment can also be used for dry cutting. However, if you need to perform water-assisted cutting on a dry cutting machine, please contact us for waterproofing modifications.

The power supply of the equipment can be customized according to customer requirement.

Please contact us before placing an order to ensure that the selected equipment meets your needs.

Product Parameter

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Description

Product Overview

The Cutting Wire Saw Machine SGSM 40 is a gantry-style cutting solution equipped with an advanced oscillation (swing) function. This innovative feature allows the cutting wire to oscillate during the top-to-bottom cutting process, with the amplitude freely adjustable to suit specific materials and requirements. Designed to handle ultra-hard materials such as alumina, sapphire, and silicon carbide, the SGSM 40 delivers faster cutting speeds, smoother surfaces, and exceptional precision.

Product Details

Key Features

Gantry-Style Structure
- The cutting wire operates parallel to the ground, performing stable, top-to-bottom cuts, ensuring material stability on the work platform.
Advanced Oscillation Function
- The cutting wire oscillates during the cutting process, with customizable swing amplitude. This reduces cutting resistance, improves speed, and enhances the surface finish.
High Cutting Precision
- The oscillation feature, combined with the gantry-style design, ensures high accuracy and smooth, chip-free cutting surfaces.
Adjustable Parameters
- Operators can freely set oscillation amplitude and other cutting parameters, allowing optimization for various ultra-hard materials.
Optimized for Ultra-Hard Materials
- Specially designed to process materials like alumina, sapphire, and silicon carbide with superior efficiency and quality.

Advantages

Faster Cutting Speeds: Oscillation reduces friction and enhances cutting efficiency, saving time on challenging materials.
Smoother Surface Finish: The oscillation motion minimizes surface roughness, delivering polished cuts without the need for secondary processing.
Versatile Operation: Customizable oscillation settings allow users to adapt to different material types and thicknesses.
Material Stability: The top-to-bottom cutting method keeps the workpiece secure on the platform, ensuring precise and consistent results.
User-Friendly Design: Intuitive controls and adjustable parameters make operation simple and efficient.

Applications

The SGSM 40 is ideal for cutting ultra-hard and brittle materials, including:

Alumina (Aluminum Oxide): For ceramics and industrial components.
Sapphire: Used in optics, electronics, and watch components.
Silicon Carbide (SiC): For semiconductor wafers, ceramics, and industrial applications.

With its innovative oscillation function, robust gantry-style design, and outstanding precision, the Cutting Wire Saw Machine SGSM 40 is the perfect solution for manufacturers seeking to optimize the cutting of ultra-hard materials with speed, efficiency, and superior surface quality.

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Alumia Cut, Gemstone Cut, Glass Cut, Graphite Cut, Metal Cut, Optics Cut, Quartz Cut, Sic Cut, Silicon Cut

$1.00

Key Features of Endless Diamond Wire Cutting Equipment:

Endless Wire Design:
- Utilizes a closed-loop diamond wire, typically less than 10 meters in length, which is significantly shorter compared to traditional diamond wire cutting machines (wire lengths exceeding 1000 meters).
- The endless design eliminates the need for frequent wire changes, improving operational efficiency.
High-Speed Wire Operation:
- The diamond wire operates at speeds of up to 80 meters/second, enabling fast cutting.
- High-speed operation ensures superior surface smoothness, eliminating or significantly reducing wire marks.
Wide Range of Applications:
- Suitable for cutting hard and brittle materials such as silicon, graphite, sapphire, quartz, alumina ceramics, silicon carbide, silicon nitride, and boron nitride.
- Especially effective for non-conductive materials (e.g., graphite) that cannot be processed using traditional EDM cutting techniques.
Exceptional Cutting Quality:
- Produces smooth cutting surfaces, often eliminating the need for additional polishing.
- Reduces material waste, which is particularly beneficial when working with expensive materials.
Eco-Friendly Operation:
- Can use water cooling or eco-friendly cooling liquids to minimize heat buildup and reduce dust emissions during cutting.

Application Fields:

Semiconductors: Cutting silicon wafers, sapphire substrates, quartz substrates, etc.
Optics: Processing optical glass, lens materials, and other precision optical components.
Renewable Energy: Cutting solar crystalline silicon and battery materials.
Aerospace: Precision machining of high-hardness ceramics and composite materials.
Other Industries: Precision machining of electronic ceramics, graphite molds, and more.

Comparison to Traditional Diamond Wire Cutting Machines:

Endless diamond wire machines feature shorter, more stable wires with higher operating speeds, making them ideal for precision applications.
No need to alternate the wire's running direction, simplifying the mechanical structure and reducing maintenance costs.

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X-axis stroke (mm)	Y-axis stroke (mm)	Z-axis space(mm)
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Customize on request	Customize on request	Customize on request